Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11416046 | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith | — | 2022-08-16 |
| 11155065 | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith | Jason Brandi, Emilie Barriau | 2021-10-26 |
| 10481653 | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith | Jason Brandi, Emilie Barriau | 2019-11-19 |
| 9223363 | Electronic devices assembled with heat absorbing and/or thermally insulating composition | Jason Brandi, Emilie Barriau | 2015-12-29 |
| 9209105 | Electronic devices assembled with thermally insulating layers | Emilie Barriau, Martin Renkel, Matthew J. Holloway, Jason Brandi | 2015-12-08 |
| 9209104 | Electronic devices assembled with thermally insulating layers | Jason Brandi | 2015-12-08 |
| 8835574 | Adhesive compositions for use in die attach applications | Tadashi Takano, Puwei Liu | 2014-09-16 |
| 8698320 | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices | Puwei Liu | 2014-04-15 |
| 8648460 | Thermal interface material with epoxidized nutshell oil | Chew B. Chan | 2014-02-11 |
| 8338536 | Adhesive compositions for use in die attach applications | Tadashi Takano, Puwei Liu | 2012-12-25 |
| 7867609 | Thermal interface materials | — | 2011-01-11 |
| 7608324 | Interface materials and methods of production and use thereof | Nancy Dean, Kenishiro Fukuyama | 2009-10-27 |
| 7244491 | Thermal interface materials | — | 2007-07-17 |
| 7172711 | Interface materials and methods of production and use thereof | — | 2007-02-06 |
| 6908669 | Thermal interface materials | — | 2005-06-21 |
| 6811725 | Compliant and crosslinkable thermal interface materials | James Grundy | 2004-11-02 |
| 6797382 | Thermal interface materials | Kim-Chi Le | 2004-09-28 |
| 6706219 | Interface materials and methods of production and use thereof | — | 2004-03-16 |
| 6673434 | Thermal interface materials | — | 2004-01-06 |
| 6605238 | Compliant and crosslinkable thermal interface materials | James Grundy, Carl Edwards | 2003-08-12 |
| 6451422 | Thermal interface materials | — | 2002-09-17 |
| 6238596 | Compliant and crosslinkable thermal interface materials | James Grundy | 2001-05-29 |
| 6117930 | Resin systems for organosilicon-containing compositions | Yuan Y. Chien | 2000-09-12 |
| 5989459 | Compliant and crosslinkable thermal interface materials | James Grundy | 1999-11-23 |
| 5859105 | Organosilicon-containing compositions capable of rapid curing at low temperature | — | 1999-01-12 |