Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4587718 | Process for forming TiSi.sub.2 layers of differing thicknesses in a single integrated circuit | Roger A. Haken, Chi-Kwan Lau | 1986-05-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4587718 | Process for forming TiSi.sub.2 layers of differing thicknesses in a single integrated circuit | Roger A. Haken, Chi-Kwan Lau | 1986-05-13 |