Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996335 | Manufacturing method of semiconductor device | — | 2024-05-28 |
| 11804471 | Method for manufacturing semiconductor device and semiconductor manufacturing apparatus | — | 2023-10-31 |
| 11107788 | Method of manufacturing semiconductor device | — | 2021-08-31 |
| 10804152 | Method of manufacturing semiconductor device | Ippei Kume, Eiichi SHIN, Eiji Takano, Takashi Shirono, Mika Fujii | 2020-10-13 |
| 10741505 | Method of manufacturing semiconductor device and semiconductor device | Eiji Takano, Ippei Kume, Yuki Noda | 2020-08-11 |
| 10546769 | Semiconductor manufacturing method and semiconductor manufacturing device | Tatsuhiko Shirakawa, Kenji Takahashi, Eiji Takano | 2020-01-28 |
| 10475675 | Manufacturing apparatus and manufacturing method of semiconductor device | Jun Tanaka | 2019-11-12 |
| 10211165 | Method of manufacturing semiconductor device and semiconductor device | Eiji Takano, Ippei Kume, Yuki Noda | 2019-02-19 |
| 10199253 | Method for manufacturing semiconductor devices through peeling using UV-ray | Kenji Takahashi | 2019-02-05 |
| 9646908 | Method for manufacturing semiconductor device and semiconductor device | Soichi Homma, Yuusuke Takano, Takeshi Watanabe, Katsunori Shibuya | 2017-05-09 |
| 9190373 | Bump structure with underbump metallization structure and integrated redistribution layer | Tatsuo Migita, Hirokazu Ezawa, Soichi Yamashita | 2015-11-17 |
| 7985663 | Method for manufacturing a semiconductor device | Takao Sato, Soichi Homma | 2011-07-26 |