Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8824142 | Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices | Nels Jewell-Larsen, Kenneth Honer, Ron Goldman | 2014-09-02 |
| 8804296 | System and method for in-situ conditioning of emitter electrode with silver | Kenneth Honer, Guilian Gao, Nels Jewell-Larsen | 2014-08-12 |
| 8488294 | Ionic fluid flow accelerator | Kenneth Honer, Nels Jewell-Larsen | 2013-07-16 |
| 8405951 | Cleaning mechanism with tandem movement over emitter and collector surfaces | Nels Jewell-Larsen, Kenneth Honer | 2013-03-26 |
| 7471520 | Impedance matching external component connections with uncompensated leads | John Wilks, Andrew Engel | 2008-12-30 |
| 7204712 | Monolithic living hinge small form factor transceiver bail-delatch | R. Sean Murphy | 2007-04-17 |
| 7111994 | Integral insert molded fiber optic transceiver electromagnetic interference shield | R. Sean Murphy | 2006-09-26 |
| 6414847 | Integral dielectric heatspreader | Brian R. Hutchison, Robert John Thompson | 2002-07-02 |
| 6239385 | Surface mountable coaxial solder interconnect and method | Ron Barnett, Geary L. Chew, Gerald J. Gleason, Dean Nicholson | 2001-05-29 |
| 6139972 | Solder paste containment device | Gary R. Trott, Geary L. Chew | 2000-10-31 |
| 6137693 | High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding | Brian R. Hutchison, Geary L. Chew, Ron Barnett | 2000-10-24 |
| 6084494 | Shuntable magnetic mask support apparatus | Geary L. Chew, Ayn R. Lavagnino, Andy H. Uchida | 2000-07-04 |
| 5880017 | Method of bumping substrates by contained paste deposition | Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas | 1999-03-09 |
| 5672542 | Method of making solder balls by contained paste deposition | Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas | 1997-09-30 |
| 5586715 | Method of making solder balls by contained paste deposition | Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas | 1996-12-24 |
| 5539153 | Method of bumping substrates by contained paste deposition | Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas | 1996-07-23 |