Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10750617 | Bond-free interconnect between a microcircuit housing and a printed circuit assembly | Michael John Harriman, Ryan Michael Avella, Leonard M. Weber, Naveed Edalati, David Massie +2 more | 2020-08-18 |
| 6414847 | Integral dielectric heatspreader | Matthew K. Schwiebert, Robert John Thompson | 2002-07-02 |
| 6137693 | High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding | Matthew K. Schwiebert, Geary L. Chew, Ron Barnett | 2000-10-24 |
| 6061251 | Lead-frame based vertical interconnect package | Peter J. Walters | 2000-05-09 |