MD

Mark Daniel Derwin

IBM: 2 patents #32,839 of 70,183Top 50%
Overall (All Time): #2,258,724 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5827386 Method for forming a multi-layered circuitized substrate member Ashwinkumar C. Bhatt, Kenneth J. Lubert 1998-10-27
5731547 Circuitized substrate with material containment means and method of making same Daniel P. Labzentis, Jonathan D. Reid, Timothy Lee Sharp 1998-03-24