Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5841195 | Semiconductor contact via structure | Yih-Shung Lin, Fu-Tai Liou, Che-Chia Wei, John L. Walters | 1998-11-24 |
| 5595935 | Method for forming interconnect in integrated circuits | Tsiu C. Chan, Frank R. Bryant, Che-Chia Wei | 1997-01-21 |
| 5500557 | Structure and method for fabricating integrated circuits | Tsiu C. Chan, Frank R. Bryant, Che-Chia Wei | 1996-03-19 |
| 5485035 | Method for planarization of an integrated circuit | Yih-Shung Lin, Kuei-Wu Huang | 1996-01-16 |
| 5246883 | Semiconductor contact via structure and method | Yih-Shung Lin, Fu-Tai Liou, Che-Chia Wei, John L. Walters | 1993-09-21 |