Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7030772 | Inspection for alignment between IC die and package substrate | Swee Peng Lee, Ajit M. Dubey, Leang Hua Kam | 2006-04-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7030772 | Inspection for alignment between IC die and package substrate | Swee Peng Lee, Ajit M. Dubey, Leang Hua Kam | 2006-04-18 |