Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5161729 | Package to semiconductor chip active interconnect site method | Thomas J. Dunaway, Richard K. Spielberger, Jerald M. Loy | 1992-11-10 |
| 5101550 | Removable drop-through die bond frame | Thomas J. Dunaway, Richard K. Spielberger | 1992-04-07 |
| 5099306 | Stacked tab leadframe assembly | Thomas J. Dunaway, Richard K. Spielberger, Jerald M. Loy, Francis J. Belcourt | 1992-03-24 |
| 5074036 | Method of die bonding semiconductor chip by using removable frame | Thomas J. Dunaway, Richard K. Spielberger | 1991-12-24 |
| 5066614 | Method of manufacturing a leadframe having conductive elements preformed with solder bumps | Thomas J. Dunaway, Richard K. Spielberger, Jerald M. Loy | 1991-11-19 |
| 5010387 | Solder bonding material | Thomas J. Dunaway, Richard K. Spielberger, Jerald M. Loy | 1991-04-23 |
| 4979289 | Method of die bonding semiconductor chip by using removable non-wettable by solder frame | Thomas J. Dunaway, Richard K. Spielberger | 1990-12-25 |
| 4980753 | Low-cost high-performance semiconductor chip package | Thomas J. Dunaway, Richard K. Spielberger | 1990-12-25 |
| 4948032 | Fluxing agent | Thomas J. Dunaway, Richard K. Spielberger | 1990-08-14 |
| 4898320 | Method of manufacturing a high-yield solder bumped semiconductor wafer | Thomas J. Dunaway, Richard K. Spielberger | 1990-02-06 |
| 4892245 | Controlled compression furnace bonding | Thomas J. Dunaway, Richard K. Speilberger, Jerald M. Loy, Luverne O. Balgaard | 1990-01-09 |