Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12235614 | Molding system for fabricating fiber reinforcement polymer composite article and molding method thereof | Chi-Hua Yu, Mao-Ken Hsu, Yi-Wen Chen, Chih-Chung Hsu, Chia-Hsiang Hsu +1 more | 2025-02-25 |
| 11602908 | Method of mesh generation for resin transfer molding process | Ching-Kai Chou, Chien-Ting Wu, Hsun YANG, Chih-Chung Hsu, Chia-Hsiang Hsu +1 more | 2023-03-14 |
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Chia-Peng Sun +3 more | 2022-12-06 |