Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8647924 | Semiconductor package and method of packaging semiconductor devices | Chin Hock Toh, Keng Yuen Au, Reynaldo Vincent H. Sta Agueda, Bee Liang Catherine Ng, Xue Ren Zhang +1 more | 2014-02-11 |
| 8274145 | Semiconductor package system with patterned mask over thermal relief | Leocadio Morona Alabin, Chiu Hsieh Ong, Beng Yee Teh, Antonio B. Dimaano, Jr. | 2012-09-25 |