Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183385 | Apparatuses and methods for a per-DRAM addressability synchronizer circuit | William C. Waldrop, Shingo Mitsubori, Ryo Fujimaki, Atsuko Momma | 2024-12-31 |
| 11955345 | Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems | Brandon P. Wirz | 2024-04-09 |
| 11094649 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Chen-Hung LEE, Hsiu-Chi Liu | 2021-08-17 |
| 10943800 | Semiconductor package device and method of forming package body | Fan-Yu MIN, Chao-Hung Weng | 2021-03-09 |
| 10168739 | Electronic device with multiple display modules | — | 2019-01-01 |