| 7898275 |
Known good die using existing process infrastructure |
Richard W. Arnold, Weldon Beardain, Daniel W. Prevedel, Donald E. Riley |
2011-03-01 |
| 7122895 |
Stud-cone bump for probe tips used in known good die carriers |
Richard W. Arnold, Weldon Beardain, James A. Forster |
2006-10-17 |
| 6906539 |
High density, area array probe card apparatus |
Reynaldo Rincon, Jerry J. Broz, Richard W. Arnold |
2005-06-14 |
| 6720574 |
Method of testing a semiconductor chip |
Richard W. Arnold, Weldon Beardain, Daniel W. Prevedel, Donald E. Riley |
2004-04-13 |
| 6720780 |
High density probe card apparatus and method of manufacture |
Reynaldo Rincon, Jerry J. Broz, Richard W. Arnold |
2004-04-13 |
| 6636063 |
Probe card with contact apparatus and method of manufacture |
Richard W. Arnold, James A. Forster, Reynaldo Rincon |
2003-10-21 |
| 6553661 |
Semiconductor test structure having a laser defined current carrying structure |
Richard W. Arnold, James A. Forster |
2003-04-29 |
| 6489673 |
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
Richard W. Arnold, Mahmood A. Siddiqui, James A. Forster |
2002-12-03 |
| 6376352 |
Stud-cone bump for probe tips used in known good die carriers |
Richard W. Arnold, Weldon Beardain, James A. Forster |
2002-04-23 |
| 6335226 |
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
Richard W. Arnold, Mahmood A. Siddiqui, James A. Forster |
2002-01-01 |
| 6209532 |
Soft handling process tooling for low and medium volume known good die product |
Richard W. Arnold |
2001-04-03 |