Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4805831 | Bonding method | — | 1989-02-21 |
| 4747533 | Bonding method and apparatus | — | 1988-05-31 |
| 4611746 | Process for forming improved solder connections for semiconductor devices with enhanced fatigue life | Ernest N. Levine, Horatio Quinones | 1986-09-16 |
| 4500945 | Directly sealed multi-chip module | — | 1985-02-19 |
| 4498530 | Flexible thermal conduction element for cooling semiconductor devices | — | 1985-02-12 |
| 4483389 | Telescoping thermal conduction element for semiconductor devices | Demetrios Balderes, Joseph L. Horvath | 1984-11-20 |
| 4442450 | Cooling element for solder bonded semiconductor devices | Ralph E. Meagher, Frank P. Presti | 1984-04-10 |