Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7152473 | Integrated and multi-axis sensor assembly and packaging | Larry Rushefsky, Axel Michael Sigmar, Howard D. Goldberg, W. Marc Stalnaker, Ray Rinne +14 more | 2006-12-26 |
| 4628411 | Apparatus for directly powering a multi-chip module from a power distribution bus | Andrew J. Frankovsky, Robert A. Jarvela | 1986-12-09 |
| 4483389 | Telescoping thermal conduction element for semiconductor devices | Joseph L. Horvath, Lewis D. Lipschutz | 1984-11-20 |
| 4233645 | Semiconductor package with improved conduction cooling structure | John R. Lynch, Robert A. Yacavonis | 1980-11-11 |