Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5126192 | Flame retardant, low dielectric constant microsphere filled laminate | Robert M. Japp, William J. Summa, William J. Rudik, David W. Wang | 1992-06-30 |
| 4704791 | Process for providing a landless through-hole connection | Theron L. Ellis | 1987-11-10 |
| 4599268 | Product containing an epoxy composition | — | 1986-07-08 |
| 4597996 | Process of laminating with an epoxy composition | — | 1986-07-01 |
| 4550128 | Epoxy composition | — | 1985-10-29 |
| 4201616 | Dimensionally stable laminated printed circuit cores or boards and method of fabricating same | Theron L. Ellis | 1980-05-06 |