LL

Larry Lewellen

SC Stats Chippac: 2 patents #228 of 425Top 55%
Overall (All Time): #2,136,766 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7598600 Stackable power semiconductor package system Wai Kwong Tang, You Yang Ong, Kuan Ming Kan 2009-10-06
7557432 Thermally enhanced power semiconductor package system Wai Kwong Tang, You Yang Ong, Kuan Ming Kan 2009-07-07