Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388040 | Semiconductor package including redistribution substrate and method of manufacturing the same | Seokhyun Lee, Dongkyu Kim, Hyeonjeong Hwang | 2025-08-12 |
| 12237250 | Semiconductor package | Dongkyu Kim, Minjung Kim, Seokhyun Lee | 2025-02-25 |
| 12068302 | Semiconductor package | Seho You | 2024-08-20 |
| 12040264 | Semiconductor package including under bump metallization pad | Hyeonjeong Hwang, Seokhyun Lee | 2024-07-16 |
| 12009274 | Semiconductor package including thermal exhaust pathway | Eungkyu Kim | 2024-06-11 |
| 11955499 | Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance | Minjung Kim, Dongkyu Kim, Jaegwon Jang, Hyeonjeong Hwang | 2024-04-09 |
| 11670629 | Semiconductor package | Seho You | 2023-06-06 |