Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245863 | Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights | Hae-Jung Yu, Hak-Kyoon Byun, Seung Hun Han, Tae-Sung Park, Choong Bin Yim | 2016-01-26 |
| 8970042 | Circuit board, comprising a core insulation film | Bok-Sik Myung, Chul Woo Kim, Young Bae Kim, Yong Hoon Kim, Hee-Seok Lee | 2015-03-03 |