Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12016164 | RF filter device for aircraft nacelle access door gap | Thomas D. Mitchum, Jr., Philipp A. Boettcher, Young Kyu Song | 2024-06-18 |
| 11462460 | Electrical module assembly with embedded dies | Young Kyu Song | 2022-10-04 |
| 11378605 | Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle | Young Kyu Song | 2022-07-05 |
| 11191983 | Fire suppressing device | Young Kyu Song | 2021-12-07 |
| 11071213 | Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives | Charles Muwonge, Terry R. Vogler, Young Kyu Song | 2021-07-20 |
| 11038277 | High impedance surface (HIS) enhanced by discrete passives | Charles Muwonge, Terry R. Vogler, Young Kyu Song | 2021-06-15 |
| 10980122 | Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance | Young Kyu Song | 2021-04-13 |
| 10903542 | Variable radio frequency attenuator | Walid M. Al-Bondak, Young Kyu Song | 2021-01-26 |
| 10653013 | Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance | Young Kyu Song | 2020-05-12 |
| 10181410 | Integrated circuit package comprising surface capacitor and ground plane | Young Kyu Song, Hong Bok We | 2019-01-15 |
| 10079097 | Capacitor structure for power delivery applications | Young Kyu Song, Hong Bok We | 2018-09-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Young Kyu Song | 2018-08-14 |
| 9933455 | Known good die testing for high frequency applications | Young Kyu Song | 2018-04-03 |
| 9875997 | Low profile reinforced package-on-package semiconductor device | Hong Bok We, Dong Wook Kim, Young Kyu Song | 2018-01-23 |
| 9837209 | Capacitor structure for wideband resonance suppression in power delivery networks | Young Kyu Song, Changhan Hobie Yun, Dong Wook Kim | 2017-12-05 |
| 9807884 | Substrate comprising embedded elongated capacitor | Young Kyu Song | 2017-10-31 |
| 9659850 | Package substrate comprising capacitor, redistribution layer and discrete coaxial connection | Hong Bok We, Young Kyu Song, Dong Wook Kim | 2017-05-23 |
| 9628052 | Embedded multi-terminal capacitor | Hong Bok We, Dong Wook Kim, Young Kyu Song | 2017-04-18 |
| 9621281 | Integrated device package and/or system comprising configurable directional optical transmitter | — | 2017-04-11 |
| 9613942 | Interposer for a package-on-package structure | Jae Sik Lee, Hong Bok We | 2017-04-04 |
| 9583433 | Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer | Young Kyu Song, Hong Bok We | 2017-02-28 |
| 9530739 | Package on package (PoP) device comprising a high performance inter package connection | Young Kyu Song | 2016-12-27 |
| 9502491 | Embedded sheet capacitor | Young Kyu Song, Dong Wook Kim, Changhan Hobie Yun | 2016-11-22 |
| 9502490 | Embedded package substrate capacitor | Hong Bok We, Young Kyu Song, Dong Wook Kim | 2016-11-22 |
| 9490226 | Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal | Young Kyu Song, Hong Bok We, Dong Wook Kim | 2016-11-08 |