Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11760711 | Epoxy compound, composition, cured product and laminate | Masato Otsu, Etsuko Suzuki | 2023-09-19 |
| 11685807 | Resin composition, cured product, laminate, and electronic member | Masato Otsu | 2023-06-27 |
| 11117873 | Oxazine compound, composition, and cured product | Tomohiro Shimono, Masato Otsu, Junji Yamaguchi, Etsuko Suzuki | 2021-09-14 |
| 11117872 | Oxazine compound, composition and cured product | Tomohiro Shimono, Junji Yamaguchi, Masato Otsu | 2021-09-14 |
| 11104788 | Composition, cured product and laminate | Masato Otsu, Etsuko Suzuki, Junji Yamaguchi, Tomohiro Shimono | 2021-08-31 |
| 11028059 | Oxazine compound, composition and cured product | Tomohiro Shimono, Junji Yamaguchi, Masato Otsu | 2021-06-08 |
| 10981865 | Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound | Junji Yamaguchi, Tomohiro Shimono, Masato Otsu | 2021-04-20 |
| 10913725 | Oxazine compound, composition and cured product | Masato Otsu, Tomohiro Shimono, Junji Yamaguchi | 2021-02-09 |
| 10577307 | Methods for producing polycyclic aromatic aminophenol compound and resin composition, and polycyclic aromatic aminophenol compound, resin composition, and cured product | Tomohiro Shimono, Junji Yamaguchi | 2020-03-03 |
| 10399312 | Oxazine compound, composition and cured product | Masato Otsu, Tomohiro Shimono, Junji Yamaguchi | 2019-09-03 |
| 10301471 | Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product | Tomohiro Shimono | 2019-05-28 |
| 10059798 | Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film | Tomohiro Shimono | 2018-08-28 |
| 9963544 | Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film | Etsuko Suzuki | 2018-05-08 |
| 9441069 | Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material | Hajime Watanabe | 2016-09-13 |
| 9217053 | Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film | Etsuko Suzuki | 2015-12-22 |
| 8791214 | Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film | Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga | 2014-07-29 |
| 8729192 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material | Ichirou Ogura, Kunihiro Morinaga | 2014-05-20 |
| 8669333 | Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film | Etsuko Suzuki | 2014-03-11 |
| 8394911 | Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board | Yutaka Satou, Ichirou Ogura | 2013-03-12 |
| 8263714 | Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin | Ichiro Ogura, Yoshiyuki Takahashi, Kunihiro Morinaga, Yutaka Satou | 2012-09-11 |
| 8168731 | Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same | Yutaka Satou, Ichirou Ogura | 2012-05-01 |
| 8084567 | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | Ichirou Ogura, Kunihiro Morinaga, Yutaka Sato | 2011-12-27 |
| 7985822 | Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin | Ichiro Ogura, Yoshiyuki Takahashi, Kunihiro Morinaga, Yutaka Satou | 2011-07-26 |
| 7718741 | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | Ichirou Ogura, Kunihiro Morinaga, Yutaka Sato | 2010-05-18 |
| 6794478 | Preparing epoxy resin by distilling two fractions to recover and reuse epihalohydrin without glycidol | Ichiro Ogura | 2004-09-21 |