Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342315 | Stack packages including through mold via structures | Bok Kyu CHOI, Jae-Hoon Lee, Jin-Woo Park | 2022-05-24 |
| 10923434 | Semiconductor packages having EMI shielding layers | Bok Kyu CHOI, Sang Joon LIM | 2021-02-16 |
| 10665570 | Stack packages including through mold vias | Jae-Hoon Lee, Bok Kyu CHOI | 2020-05-26 |