Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759965 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, David Lee DeWire, Richard J. Ross | 2014-06-24 |
| 8639373 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, David Lee DeWire, Richard J. Ross | 2014-01-28 |
| 8560104 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, David Lee DeWire, Richard J. Ross | 2013-10-15 |
| 8283769 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, David Lee DeWire, Richard J. Ross | 2012-10-09 |
| 8153474 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, David Lee DeWire, Richard J. Ross | 2012-04-10 |
| 6324755 | Solid interface module | Michael T. Borkowski, Thomas V. Sikina | 2001-12-04 |
| 5154625 | Integrated DC/RF connector | Michael R. Borokowski | 1992-10-13 |