Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11382224 | Hermetically sealed electronic packages with electrically powered multi-pin electrical feedthroughs | Hua Xia, Nathan Foster, Nelson Settles, Steve Hall | 2022-07-05 |
| 8759965 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, John W. Roman, Richard J. Ross | 2014-06-24 |
| 8639373 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, John W. Roman, Richard J. Ross | 2014-01-28 |
| 8560104 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, John W. Roman, Richard J. Ross | 2013-10-15 |
| 8283769 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, John W. Roman, Richard J. Ross | 2012-10-09 |
| 8153474 | Modular low stress package technology | Craig J. Rotay, John Ni, David Lam, John W. Roman, Richard J. Ross | 2012-04-10 |