Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7608924 | Liquid cooled power electronic circuit comprising stacked direct die cooled packages | Bruce A. Myers | 2009-10-27 |
| 7563992 | Electronic enclosure with continuous ground contact surface | Daniel A. Lawlyes | 2009-07-21 |
| 7436270 | Structure and method for improving the reliability of surface mounted ceramic duplexers | Michael T. Dolce | 2008-10-14 |
| 6725514 | Method of making thick film pressure and temperature sensors on a stainless steel diaphragm | James I. Moyer | 2004-04-27 |
| 6536286 | Pressure sensor connector | James I. Moyer, Daniel A. Lawlyes, Paul J. Pitzer, Perry L. Martinson, Steven T. Reyburn | 2003-03-25 |
| 6447342 | Pressure sensor connector | Daniel A. Lawlyes | 2002-09-10 |
| 5867886 | Method of making a thick film pressure sensor | John Hart | 1999-02-09 |
| 4647894 | Novel designs for packaging circuit protection devices | — | 1987-03-03 |
| 4647896 | Materials for packaging circuit protection devices | — | 1987-03-03 |