Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6452116 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Gregg J. Armezzani, Kishor Desai, Jeffrey S. Perkins | 2002-09-17 |
| 6272742 | Method of electrically connecting substrates using solder balls | Gregg J. Armezzani, Kishor Desai, Jeffery S. Perkins | 2001-08-14 |
| 6023029 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Gregg J. Armezzani, Kishor Desai, Jeffery S. Perkins | 2000-02-08 |
| 5884397 | Method for fabricating chip carriers and printed circuit boards | Gregg J. Armezzani, Kishor Desai, Jeffrey S. Perkins | 1999-03-23 |