Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791321 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Sang-Sub Song | 2023-10-17 |
| 11251169 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Sang-Sub Song | 2022-02-15 |
| 9437518 | Semiconductor module | Jaebum Byun, Heeyoub Kang, Dongok Kwak, Junghoon Kim, Won-Hwa Lee +2 more | 2016-09-06 |