| 11877041 |
Sensor with multiple focal zones |
Russell Wayne Gruhlke, Ravindra V. Shenoy, Donald William Kidwell, Jr., Khurshid Syed Alam, Kebin Li |
2024-01-16 |
| 11711594 |
Dual image sensor package |
Ravindra V. Shenoy, Ravishankar Sivalingam, Russell Wayne Gruhlke, Donald William Kidwell, Jr., Khurshid Syed Alam +1 more |
2023-07-25 |
| 11678043 |
Sensor module with a collar |
Russell Wayne Gruhlke, Ravindra V. Shenoy, Ravishankar Sivalingam, Kebin Li, Khurshid Syed Alam |
2023-06-13 |
| 11450964 |
Antenna assembly with a conductive cage |
Seong Heon Jeong, Mohammad Ali Tassoudji, Jeremy Darren Dunworth, Ravindra V. Shenoy |
2022-09-20 |
| 11411321 |
Broadband antenna system |
Donald William Kidwell, Jr., Ravindra V. Shenoy, Mohammad Ali Tassoudji, Jeremy Darren Dunworth, Vladimir Aparin +2 more |
2022-08-09 |
| 11277559 |
Image sensor system |
Evgeni Gousev, Ravindra V. Shenoy, Russell Wayne Gruhlke, Khurshid Syed Alam, Kebin Li +1 more |
2022-03-15 |
| 11228086 |
Antenna package and configuration for millimeter wave |
Ravindra V. Shenoy, Mohammad Ali Tassoudji, Seong Heon Jeong, Jeremy Darren Dunworth |
2022-01-18 |
| 11223116 |
Glass ceramic antenna package |
Seong Heon Jeong, Ravindra V. Shenoy, Jeremy Darren Dunworth, Mohammad Ali Tassoudji |
2022-01-11 |
| 11115576 |
Sensor module with a collar configured to be attached to a camera module for a user device |
Russell Wayne Gruhlke, Ravindra V. Shenoy, Ravishankar Sivalingam, Kebin Li, Khurshid Syed Alam |
2021-09-07 |
| 10770646 |
Manufacturing method for flexible PMUT array |
Donald William Kidwell, Jr., Ravindra V. Shenoy |
2020-09-08 |
| 10734332 |
High aspect ratio interconnects in air gap of antenna package |
Ravindra V. Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Vladimir Aparin, Seong Heon Jeong +4 more |
2020-08-04 |
| 10722918 |
Release hole plus contact via for fine pitch ultrasound transducer integration |
Donald William Kidwell, Jr., Ravindra V. Shenoy |
2020-07-28 |
| 10685924 |
Antenna-on-package arrangements |
Ravindra V. Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez |
2020-06-16 |
| 10618079 |
Piezoelectric micromechanical ultrasonic transducers and transducer arrays |
Donald William Kidwell, Jr., Ravindra V. Shenoy |
2020-04-14 |
| 10497748 |
Integrated piezoelectric micromechanical ultrasonic transducer pixel and array |
Hrishikesh Vijaykumar Panchawagh, Suryaprakash Ganti, Kostadin Dimitrov Djordjev, David William Burns, Timothy Dickinson +4 more |
2019-12-03 |
| 10490880 |
Glass-based antenna array package |
Ravindra V. Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez |
2019-11-26 |
| 10478858 |
Piezoelectric ultrasonic transducer and process |
Ravindra V. Shenoy, Evgeni Gousev, Hrishikesh Vijaykumar Panchawagh, David William Burns, Nai-Kuei Kuo +2 more |
2019-11-19 |
| 10394004 |
Systems and devices having single-sided wafer-level optics |
Todor G. Georgiev, Wen Sun, Zheng Li |
2019-08-27 |
| 10199152 |
Embedded thin film magnetic carrier for integrated voltage regulator |
Mete Erturk, Ravindra V. Shenoy, Kwan-Yu Lai, Jitae Kim, Donald William Kidwell, Jr. +2 more |
2019-02-05 |
| 10109784 |
Sensor device |
Donald William Kidwell, Jr., Ravindra V. Shenoy |
2018-10-23 |
| 10001552 |
Three-port piezoelectric ultrasonic transducer |
Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti +4 more |
2018-06-19 |
| 9773862 |
High quality factor capacitors and methods for fabricating high quality factor capacitors |
Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez +4 more |
2017-09-26 |
| 9548350 |
High quality factor capacitors and methods for fabricating high quality factor capacitors |
Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez +4 more |
2017-01-17 |
| 9510454 |
Integrated interposer with embedded active devices |
Vidhya Ramachandran, Urmi Ray, Ravindra V. Shenoy, Kwan-Yu Lai |
2016-11-29 |
| 9325420 |
Electro-optical transceiver device to enable chip-to-chip interconnection |
Kwan-Yu Lai, Ravindra V. Shenoy, Jitae Kim, Donald William Kidwell, Jr., Evgeni Gousev |
2016-04-26 |