Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6063696 | Method of reducing wafer particles after partial saw using a superhard protective coating | Mike Brenner, Timothy J. Hogan, Lawrence D. Dyer, Lisa A. T. Lester | 2000-05-16 |