Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8549744 | Printed circuit board using bump and method for manufacturing thereof | Hee-Bum Shin, Dong-Jin Park, Jee-Soo Mok, Ki Hwan Kim | 2013-10-08 |
| 7169707 | Method of manufacturing package substrate with fine circuit pattern using anodic oxidation | Duck Young Maeng, Byung-Kook Sun, Tae Hoon Kim, Jee-Soo Mok, Yoong Oh +2 more | 2007-01-30 |