Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791229 | Protection structures in semiconductor chips and methods for forming the same | — | 2023-10-17 |
| 11710717 | Methods for multi-wafer stacking and dicing | — | 2023-07-25 |
| 10892280 | Inter-deck plug in three-dimensional memory device and method for forming the same | Qianbin Xu, Haohao Yang, Enbo Wang, Yong Zhang | 2021-01-12 |
| 10763099 | Wafer flatness control using backside compensation structure | Xiaowang Dai, Zhenyu Lu, Qian Tao, Yushi Hu, Ji Xia +1 more | 2020-09-01 |
| 10741578 | Inter-deck plug in three-dimensional memory device and method for forming the same | Qianbin Xu, Haohao Yang, Enbo Wang, Yong Zhang | 2020-08-11 |