| 12411474 |
Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control method |
Chih-Fu Tsai, Yu-Chia Chang, Bo-Jiun Yang, Yen-Hwei Hsieh, Shun-Yao Yang +2 more |
2025-09-09 |
| 11989005 |
Adaptive thermal ceiling control system |
Bo-Jr Huang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu +3 more |
2024-05-21 |
| 10109566 |
Semiconductor package |
Tzu-Hung Lin |
2018-10-23 |
| 10067000 |
Inverter and ring oscillator with high temperature sensitivity |
Bo-Jr Huang, Yi-Feng James Chen |
2018-09-04 |
| 9904751 |
Computer-implemented method of designing a modularized stacked integrated circuit |
— |
2018-02-27 |
| 9904752 |
Methods for distributing power in layout of IC |
Zwei-Mei Lee, Bo-Jr Huang, Chi-Jih Shih |
2018-02-27 |
| 9679830 |
Semiconductor package |
Tzu-Hung Lin |
2017-06-13 |
| 9660017 |
Microelectronic package with surface mounted passive element |
Chao-Yang Yeh, Chee-Kong Ung, Tzu-Hung Lin |
2017-05-23 |
| 9589092 |
Method for co-designing flip-chip and interposer |
Chi-Jih Shih, Shen-Yu Huang |
2017-03-07 |
| 9552452 |
Method and apparatus for flip chip packaging co-design and co-designed flip chip package |
Shen-Yu Huang |
2017-01-24 |
| 9490808 |
Sensing circuit |
Bo-Jr Huang |
2016-11-08 |
| 9379079 |
Flip chip scheme and method of forming flip chip scheme |
Shen-Yu Huang |
2016-06-28 |
| 9305131 |
Method for flip chip packaging co-design |
Shen-Yu Huang |
2016-04-05 |