Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646285 | Semiconductor package using core material for reverse reflow | Jeong Tak MOON, Jae Hun Song, Young Woo Lee, Seul Gi LEE, Min Su Park +1 more | 2023-05-09 |
| 9391039 | Solder balls and semiconductor device employing the same | Jeong Tak MOON, Santosh Kumar, Eung Jae KIM, Hui Joong KIM, Ho Gun CHA | 2016-07-12 |