Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5742100 | Structure having flip-chip connected substrates | Conrad S. Monroe | 1998-04-21 |
| 4933741 | Multifunction ground plane | — | 1990-06-12 |
| 4933747 | Interconnect and cooling system for a semiconductor device | — | 1990-06-12 |
| 4805007 | Flip chip module | — | 1989-02-14 |
| 4722914 | Method of making a high density IC module assembly | James E. Drye, Vern H. Winchell, II | 1988-02-02 |
| 4630096 | High density IC module assembly | James E. Drye, Vern H. Winchell, II | 1986-12-16 |
| 4613670 | Group IVB metal containing polydyes | Charles E. Carraher, Jr., Richard A. Schwarz | 1986-09-23 |
| 4513355 | Metallization and bonding means and method for VLSI packages | Ernel R. Winkler | 1985-04-23 |
| 4312981 | Modified cellulosic products having enhanced thermal, solvent, and biological properties | Charles E. Carraher, Jr., David J. Giron, Christy A. McNeely | 1982-01-26 |