Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218099 | Interposer and semiconductor package including the same | Jungsoo Byun, Taesung Jeong, Younggwan Ko | 2025-02-04 |
| 11990439 | Semiconductor package including under bump metallization pad | Changeun Joo, Gyujin Choi | 2024-05-21 |
| 11417595 | Semiconductor package and method of manufacturing the same | Seunghun CHAE, Youngkwan Seo, Soyeon MOON, Hyeyeong JO, Iljong SEO | 2022-08-16 |
| 11088115 | Interposer and semiconductor package including the same | Jungsoo Byun, Taesung Jeong, Younggwan Ko | 2021-08-10 |