| 7814649 |
Method of making circuitized substrate with filled isolation border |
John M. Lauffer, Voya R. Markovich |
2010-10-19 |
| 7491896 |
Information handling system utilizing circuitized substrate with split conductive layer |
John M. Lauffer, Voya R. Markovich |
2009-02-17 |
| 7377033 |
Method of making circuitized substrate with split conductive layer and information handling system utilizing same |
John M. Lauffer, Voya R. Markovich |
2008-05-27 |
| 7348677 |
Method of providing printed circuit board with conductive holes and board resulting therefrom |
John M. Lauffer, Voya R. Markovich, Kostas Papathomas |
2008-03-25 |
| 7211289 |
Method of making multilayered printed circuit board with filled conductive holes |
John M. Lauffer, Voya R. Markovich, Kostas Papathomas |
2007-05-01 |
| 7157647 |
Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
John M. Lauffer, Voya R. Markovich |
2007-01-02 |
| 7157646 |
Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
John M. Lauffer, Voya R. Markovich |
2007-01-02 |
| 6483046 |
Circuit board having burr free castellated plated through holes |
David E. Houser, Jeffrey L. Lee, Francis S. Poch |
2002-11-19 |
| 6105246 |
Method of making a circuit board having burr free castellated plated through holes |
David E. Houser, Jeffrey L. Lee, Francis S. Poch |
2000-08-22 |
| 4979862 |
Automatic loading mechanism |
Richard A. Bartlett, Dominic A. Casale, John J. Konrad, Donald R. Olson, Charles R. Pigos, Jr. |
1990-12-25 |
| 4869418 |
Solder leveling method and apparatus |
John P. Simpson, Gary L. Newman, Alan J. Emerick |
1989-09-26 |
| 4799616 |
Solder leveling method and apparatus |
John P. Simpson, Gary L. Newman, Alan J. Emerick |
1989-01-24 |
