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Method for regenerating silicon from silicon waste and silicon manufactured using the same |
Gu-Sung Kim, Kun Kul Ryoo |
2014-09-02 |
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Method for manufacturing wafer level chip scale package using redistribution substrate |
— |
2007-09-04 |
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Method and apparatus providing read channel optimization insurance to avoid divergence in channel optimization in an assembled disk drive |
Jong-Yun Yun, Chin Won Cho, Hu Yul Bang |
2005-10-11 |
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METHOD AND APPARATUS DETECTING BASE LINE POPPING NOISE IN A READ HEAD AND STABILIZING THE MAGNETIC DOMAIN OF MERGED MAGNETORESISTIVE READ-WRITE HEADS USING DC WRITE CURRENT AND READ BIAS CURRENT FOR AN ASSEMBLED DISK DRIVE |
Jong-Yun Yun, Chin Won Cho, Chang-dong Yeo |
2004-12-07 |
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Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof |
— |
2000-07-25 |
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Wire bond packages for semiconductor chips and related methods and assemblies |
Kyu Jin Lee, Do Soo Jeong |
2000-01-11 |
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Stacking and soldering apparatus for three dimensional stack package devices |
— |
1999-11-02 |
| 5954837 |
Method for optimizing viterbi detector threshold values |
— |
1999-09-21 |
| 5930096 |
Overvoltage and surge protection circuit in a hard disk drive |
— |
1999-07-27 |
| 5625221 |
Semiconductor assembly for a three-dimensional integrated circuit package |
Dong Kwan Kim, Seung Ho Ahn |
1997-04-29 |