| 6265240 |
Method and apparatus for passively aligning components on semiconductor dies |
Mindaugas F. Dautartas, John W. Osenbach, Edward A. Pitman |
2001-07-24 |
| 6119921 |
Bonding of aluminum oxide components to silicon substrates |
Michael Brady, Mindaugas F. Dautartas, Sailesh Mansinh Merchant, Casimir R. Nijander, John W. Osenbach |
2000-09-19 |
| 6117794 |
Method for improved metal oxide bonding of optical elements |
John W. Osenbach, Marilyn Markey Ecker |
2000-09-12 |
| 6058676 |
Lid guide for electronic devices |
Bruce C. Abraham, Patrick J. Drummond, Daniel Kern |
2000-05-09 |
| 6043443 |
Fabrication of semiconductor devices |
Patrick J. Doran, Patrick J. Drummond, Daniel Kern |
2000-03-28 |
| 6034405 |
Bonding of aluminum oxide components to silicons substrates |
Michael Brady, Mindaugas F. Dautartas, Sailesh Mansinh Merchant, Casimir R. Nijander, John W. Osenbach |
2000-03-07 |
| 5989354 |
Method for removing thin, organic materials from semiconductor dies and micro-lenses |
John W. Osenbach |
1999-11-23 |