Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11317514 | Method for forming circuits using seed layer and etchant composition for selective etching of seed layer | Kwang-Choon Chung, Byung Woong Moon, Su Han Kim, Jung Yoon Moon, Jae Rin Kim | 2022-04-26 |
| 11160171 | Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition | Kwang-Choon Chung, Su Han Kim, Jung Yoon Moon, Byung Woong Moon | 2021-10-26 |