Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11317514 | Method for forming circuits using seed layer and etchant composition for selective etching of seed layer | Kwang-Choon Chung, Byung Woong Moon, Su Han Kim, Hyeon-Jun Seong, Jae Rin Kim | 2022-04-26 |
| 11160171 | Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition | Kwang-Choon Chung, Su Han Kim, Hyeon-Jun Seong, Byung Woong Moon | 2021-10-26 |
| 11089691 | Microcircuit forming method and etching fluid composition | Su Han Kim, Kwang-Choon Chung, Sung In Ha, Byung Woong Moon | 2021-08-10 |