Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11453823 | Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite | Kwang-Choon Chung, Su Han Kim, Jae Rin Kim | 2022-09-27 |
| 11317514 | Method for forming circuits using seed layer and etchant composition for selective etching of seed layer | Kwang-Choon Chung, Su Han Kim, Jung Yoon Moon, Hyeon-Jun Seong, Jae Rin Kim | 2022-04-26 |
| 11160171 | Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition | Kwang-Choon Chung, Su Han Kim, Jung Yoon Moon, Hyeon-Jun Seong | 2021-10-26 |
| 11089691 | Microcircuit forming method and etching fluid composition | Su Han Kim, Kwang-Choon Chung, Jung Yoon Moon, Sung In Ha | 2021-08-10 |
| 10887997 | Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB | Kwang-Choon Chung | 2021-01-05 |
| 10383212 | Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same | Kwang-Choon Chung | 2019-08-13 |