Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D795262 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-22 |
| D795261 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-22 |
| D794641 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-15 |
| D794642 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-15 |
| D794643 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-15 |
| D794644 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-15 |
| D794034 | Memory device | Do-Geun Kim, Hong Kyun Kim, Young-bok Jeon | 2017-08-08 |
| 9208068 | Data storage devices including multiple host interfaces and user devices including the same | Joonhee Lee, Jinhyuk Lee | 2015-12-08 |
| 8982567 | Device including circuit board with different form factor terminal sets and assemblies including the same | Dogeun Kim, Hongkyun Kim, Youngbok Jeon | 2015-03-17 |
| 8934255 | Super capacitor casing and supercapacitor embedded device | Jung-Hyeon Kim | 2015-01-13 |
| 8385079 | Pressure conductive sheet | Jae Hoon Choi, Jae-Seon Hwang, Hai-Young Lee | 2013-02-26 |
| 8339794 | Super capacitor casing and supercapacitor embedded device | Jung-Hyeon Kim | 2012-12-25 |
| 8240360 | Fin-type heat sink for electronic component | Jung-Hyeon Kim | 2012-08-14 |
| 8218330 | Reworkable passive element embedded printed circuit board | Dong-Chun Lee, Seong-Chan Han, Jun-Young Lee, Jung-Hyeon Kim | 2012-07-10 |
| 8189342 | Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly | Dong-Chun Lee, Ho-Geon Song, Seong-Chan Han, Kwang-Su Yu, Dong-Woo Shin | 2012-05-29 |
| 7990734 | Semiconductor memory module with reverse mounted chip resistor | Hyun-Seok Choi, Hyung-Mo Hwang, Yong Hyun Kim, Su-Yong An | 2011-08-02 |
| 7968994 | Memory modules and systems including the same | — | 2011-06-28 |
| 7906423 | Semiconductor device and method of manufacturing the same | Heui-Seog Kim, Dong-Chun Lee, Seong-Chan Han, Jung-Hyeon Kim | 2011-03-15 |
| 7900349 | Method of fabricating an electronic device | Seong-Chan Han, Dong-Woo Shin, Young-Soo Lee, Hun Han | 2011-03-08 |
| 7902664 | Semiconductor package having passive component and semiconductor memory module including the same | Dong-Chun Lee, Seong-Chan Han, Kyung-Du Kim, Sun-kyu Hwang | 2011-03-08 |
| 7791178 | Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same | Heui-Seog Kim, Seong-Chan Han, Jung-Hyeon Kim, Sung Hwan Kim | 2010-09-07 |
| 7715200 | Stacked semiconductor module, method of fabricating the same, and electronic system using the same | Jung-Chan Cho, Yang Je Lee, Hyun-Seok Choi, Yong Hyun Kim, Jung-Hyeon Kim +5 more | 2010-05-11 |
| 7663219 | Semiconductor device and method of manufacturing the same | Heui-Seog Kim, Dong-Chun Lee, Seong-Chan Han, Jung-Hyeon Kim | 2010-02-16 |
| 7576437 | Printed circuit board of semiconductor package and method for mounting semiconductor package using the same | Seong-Chan Han, Dong-Chun Lee, Kwang-Su Yu, Dong-Woo Shin, Hyun-Seok Choi +1 more | 2009-08-18 |
| 7521788 | Semiconductor module with conductive element between chip packages | Byung-Man Kim, Dong-Chun Lee, Kwang-Su Yu | 2009-04-21 |