HY

Hwai-Peng Yeoh

IN Intel: 2 patents #13,213 of 30,777Top 45%
Overall (All Time): #2,204,874 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6600233 Integrated circuit package with surface mounted pins on an organic substrate Hamid Azimi, Amir Nur Rashid Wagiman, Mirng-Ji Lii 2003-07-29
6413849 Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor Hamid Azimi, Amir Wagiman, Mirng-Ji Lii 2002-07-02