Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400944 | Board-level pad pattern for multi-row QFN packages | Hsuan-Yi Lin, Shao-Chun Ho, Yi Wen Chiang, Pu-Shan Huang | 2025-08-26 |
| 12309921 | Board-level pad pattern for multi-row QFN packages | Shao-Chun Ho, Hsuan-Yi Lin, Pu-Shan Huang | 2025-05-20 |
| 11791178 | Compliant mechanical system for mini/micro chip mass transfer and packaging | Zhishen Liao, Xin Chen, Zhihang Lin, Jian Gao, Qiang Liu +1 more | 2023-10-17 |
| 11715655 | Flexure-based continuous ejector pin mechanism for mini/micro chip mass transfer | Xin Chen, Zhihang Lin, Hongcheng Li, Jian Gao, Qiang Liu +1 more | 2023-08-01 |
| 10239167 | Stiffness-frequency adjustable XY micromotion stage based on stress stiffening | Zhijun Yang, Youdun Bai, Xin Chen, Jian Gao, Haidong Yang +1 more | 2019-03-26 |
| 9846756 | Layout method for printed circuit board | Fu-Kang Pan, Nan-Cheng Chen, Shih-Chieh Lin, Ying-Lin Liu, Yang Liu +1 more | 2017-12-19 |
| 9158880 | Layout method for printed circuit board | Fu-Kang Pan, Nan-Cheng Chen, Shih-Chieh Lin, Ying-Lin Liu, Yang Liu | 2015-10-13 |