Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12286706 | Structures and methods for processing a semiconductor substrate | Ming-Yi Shen, Yao-Fong DAI, Pei-Yuan TAI, Chin-Wei Chen, Yin-Tun Chou +2 more | 2025-04-29 |
| 11174157 | Semiconductor device packages and methods of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Yu-Hsuan Tsai, Yin Chen, San Yu | 2021-11-16 |
| 11081413 | Semiconductor package with inner and outer cavities | Yu-Hsuan Tsai, Chang Chin Tsai, Lu-Ming Lai, Ching-Han Huang | 2021-08-03 |