Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156325 | Package carrier with improved heat dissipation efficiency and manufacturing method thereof | Ming-Hao Wu, Chi-Chun Po | 2024-11-26 |
| 12016133 | Circuit board with a conductive bump mounted on an adhesive layer | Ming-Hao Wu | 2024-06-18 |
| 11545412 | Package structure and manufacturing method thereof | Pei-Wei Wang, Ching-Sheng Chen, Ra-Min Tain, Ming-Hao Wu | 2023-01-03 |
| 10881006 | Package carrier and package structure | Ra-Min Tain, Pei-Chang Huang, Chi-Chun Po, Chun-Lin Liao, Po-Hsiang Wang | 2020-12-29 |
| 10655789 | Light-emitting device | Been-Yu Liaw, Jian-Qin Liang, Kang HUANG, Zhi-Guang Shen | 2020-05-19 |
| D777953 | Lamp | Ming-Huang Hsu | 2017-01-31 |
| D770064 | Lamp | Wei-Chiang Hu, Chiu-Lin Yao | 2016-10-25 |