Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8618539 | Interconnect sensor for detecting delamination | Brian Matthew Henderson, Shiqun Gu, Mark M. Nakamoto, Arvind Chandrasekaran | 2013-12-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8618539 | Interconnect sensor for detecting delamination | Brian Matthew Henderson, Shiqun Gu, Mark M. Nakamoto, Arvind Chandrasekaran | 2013-12-31 |