Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728426 | Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member | Hirokazu Okada, Tsuyoshi Amakawa, Muneo Miura | 2017-08-08 |
| 9580827 | Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member | Hirokazu Okada, Tsuyoshi Amakawa, Muneo Miura | 2017-02-28 |
| 7056770 | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material | Osamu Nakagawa, Kinya Fujino, Shinji Takase, Hideki Tokuyama, Koichi Meguro +2 more | 2006-06-06 |