Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728426 | Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member | Hirokazu Okada, Hiroshi Uragami, Tsuyoshi Amakawa | 2017-08-08 |
| 9580827 | Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member | Hirokazu Okada, Hiroshi Uragami, Tsuyoshi Amakawa | 2017-02-28 |
| 7439101 | Resin encapsulation molding method for semiconductor device | Tomoya Shimonaka, Andrew Lee | 2008-10-21 |