TS

Tomoya Shimonaka

TO Towa: 1 patents #36 of 110Top 35%
Overall (All Time): #3,367,987 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7439101 Resin encapsulation molding method for semiconductor device Muneo Miura, Andrew Lee 2008-10-21